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| INTEGRATED CIRCUITS DATA SHEET TZA3012AHW 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Product specification Supersedes data of 2002 Sep 10 2003 May 21 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver FEATURES * Single 3.3 V power supply * I2C-bus and pin programmable fibre optic receiver. Dual limiter features * Dual limiting input with 12 mV sensitivity * Received Signal Strength Indicator (RSSI) * Loss Of Signal (LOS) indicator with threshold adjust * Differential overvoltage protection. Data and clock recovery features * Supports SHD/SONET bit rates at 155.52, 622.08, 2488.32 and 2666.06 Mbits/s (STM16/OC48 + FEC) * Supports Gigabit Ethernet at 1250 and 3125 Mbits/s * Supports Fibre Channel at 1062.5 and 2125 Mbits/s * ITU-T compliant jitter tolerance * Frequency lock indicator * Stable clock signal when input data absent * Outputs for recovered data and clock loop mode. Demultiplexer features * 1:16, 1:10, 1:8 or 1:4 demultiplexing ratio * LVPECL or CML demultiplexer outputs * Frame detection for SDH/SONET and GE frames * Parity bit generation * Loop mode inputs to demultiplexer. Additional features with the I2C-bus * A-rateTM(1) supports any bit rate from 30 Mbits/s to 3.2 Gbits/s with one reference frequency * Programmable frequency resolution of 10 Hz * Four reference frequency ranges * Adjustable swing of data, clock and parallel outputs * Programmable polarity of all RF I/Os (1) A-rate is a Trademark of Koninklijke Philips Electronics N.V. TZA3012AHW * Exchangeable pin designations of RF clock with data for all I/Os for optimum connectivity * Reversible pin designations of parallel data bus bits for optimum connectivity * Slice level adjustment to improve Bit Error Rate (BER) * Mute function for a forced logic 0 output state * Programmable parity * Programmable 32-bit frame detection. APPLICATIONS * Any optical transmission system with bit rates between 30 Mbits/s and 3.2 Gbits/s * Physical interface IC in receive channels * Transponder applications * Dense Wavelength Division Multiplexing (DWDM) systems. GENERAL DESCRIPTION The TZA3012AHW is a fully integrated optical network receiver containing a dual limiter, Data and Clock Recovery (DCR) and a demultiplexer with demultiplexing ratios 1:16, 1:10, 1:8 or 1:4. The A-rate feature allows the IC to operate at any bit rate between 30 Mbits/s and 3.2 Gbits/s using a single reference frequency. The receiver supports loop modes with serial clock and data inputs and outputs. All clock signals are generated using a fractional N synthesizer with 10 Hz resolution giving a true, continuous rate operation. For full configuration flexibility, the receiver is programmable by pin or via the I2C-bus. ORDERING INFORMATION TYPE NUMBER TZA3012AHW PACKAGE NAME HTQFP100 DESCRIPTION plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad VERSION SOT638-1 2003 May 21 2 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 2003 May 21 LOSTH1 7 RSSI INSEL IN1 IN1Q 12 9 10 LIM 16 IN2 17 IN2Q LPF RSSI LOS LOSTH2 SCL(DR2) SDA(DR1) CS(DR0) UI i.c. 2 19 24 23 22 4 28, 29 14 8, 11, 15, 18 4 VCCA 20 RSSI2 21 LOS2 WINSIZE LIM = Limiting amplifier. RSSI = Receiving Signal Strength Indicator. LOS = Loss Of Signal detector. LPF = Low-Pass Filter. DMX = Demultiplexer. 13 33 34 27 2 CREFQ CREF 3 90 13 VDD VCCD ENLOUTQ VCCO VEE 1, 35, 40, 43, 51 75, 76, 83, 86, 89, 93, 96, 99 32 INTERRUPT CONTROLLER 92 I2C-BUS 97 98 FREQUENCY WINDOW DETECTOR LIM 2 2 2 41 42 36 37 94 95 BLOCK DIAGRAM Philips Semiconductors pagewidth 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver CLOOP RSSI1 6 LOS1 5 DLOOP 87 DMXR0 ENBA DMXR1 ENLINQ DLOOPQ CLOOPQ 88 84 85 91 52 30 31 38 39 44, 46, 48, 53 55, 57, 59, 61, 64, 66, 68, 70 72, 77, 79, 81 PARITY PARITYQ LOS TZA3012AHW c d DMX 1 : 4 16 1:8 1 : 10 1 : 16 PARITY GENERATOR AND BUS SWAP 16 D00 to D15 SWITCH PHASE 2 DETECTOR d c 16 45, 47, 49, 54 56, 58, 60, 62, 65, 67, 69, 71 73, 78, 80, 82 D00Q to D15Q POCLK POCLKQ FP FPQ COUT COUTQ DOUT DOUTQ INT 3 RREF 25 26, 50, 63, 74, 100 MGU314 PRSCLOQ PRSCLO TZA3012AHW INWINDOW Product specification Fig.1 Simplified block diagram. Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver PINNING SYMBOL VEE VCCD PRSCLO PRSCLOQ UI LOS1 RSSI1 LOSTH1 VCCA IN1 IN1Q VCCA INSEL WINSIZE RREF VCCA IN2 IN2Q VCCA LOSTH2 RSSI2 LOS2 CS(DR0) SDA(DR1) SCL(DR2) VDD VEE INWINDOW i.c. i.c. DMXR0 DMXR1 2003 May 21 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 DESCRIPTION supply voltage (digital part) prescaler output prescaler inverted output user interface select first input channel loss of signal output first input channel received signal strength indicator output first input channel loss of signal threshold input supply voltage (analog part) first channel input first channel inverted input supply voltage (analog part) input selector wide and narrow frequency detect window select reference resistor input supply voltage (analog part) second channel input second channel inverted input supply voltage (analog part) second input channel loss of signal threshold input second input channel received signal strength indicator output LOS output of second input channel chip select (data rate select 0) I2C-bus serial data (data rate select 1) I2C-bus serial clock (data rate select 2) supply voltage (digital part) ground frequency window detector output internally connected internally connected demultiplexing ratio select 0 demultiplexing ratio select 1 4 SYMBOL VCCO CREF CREFQ VCCD FP FPQ PARITY PARITYQ VCCD POCLK POCLKQ VCCD D00 D00Q D01 D01Q D02 D02Q VEE VCCD ENBA D03 D03Q D04 D04Q D05 D05Q D06 D06Q D07 D07Q VEE D08 D08Q D09 D09Q D10 D10Q D11 D11Q D12 die pad common ground plane PIN 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 TZA3012AHW DESCRIPTION supply voltage (clock generator) reference clock input reference clock inverted input supply voltage (digital part) frame pulse output frame pulse inverted output parity output parity inverted output supply voltage (digital part) parallel clock output parallel clock inverted output supply voltage (digital part) parallel data 00 output parallel data 00 inverted output parallel data 01 output parallel data 01 inverted output parallel data 02 output parallel data 02 inverted output ground supply voltage (digital part) byte alignment enable input parallel data 03 output parallel data 03 inverted output parallel data 04 output parallel data 04 inverted output parallel data 05 output parallel data 05 inverted output parallel data 06 output parallel data 06 inverted output parallel data 07 output parallel data 07 inverted output ground parallel data 08 output parallel data 08 inverted output parallel data 09 output parallel data 09 inverted output parallel data 10 output parallel data 10 inverted output parallel data 11 output parallel data 11 inverted output parallel data 12 output Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SYMBOL D12Q VEE VCCD VCCD D13 D13Q D14 D14Q D15 D15Q VCCD CLOOP CLOOPQ VCCD DLOOP DLOOPQ VCCD PIN 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 ground supply voltage (digital part) supply voltage (digital part) parallel data 13 output parallel data 13 inverted output parallel data 14 output parallel data 14 inverted output parallel data 15 output parallel data 15 inverted output supply voltage (digital part) loop mode clock input loop mode clock inverted input supply voltage (digital part) loop mode data input loop mode data inverted input supply voltage (digital part) INT VCCD COUT COUTQ VCCD DOUT DOUTQ VCCD VEE 92 93 94 95 96 97 98 99 100 ENLINQ 91 DESCRIPTION parallel data 12 inverted output SYMBOL ENLOUTQ PIN 90 TZA3012AHW DESCRIPTION line loop back enable input (active LOW) diagnostic loop back enable input (active LOW) interrupt output supply voltage (digital part) recovered clock output recovered clock inverted output supply voltage (digital part) recovered data output recovered data inverted output supply voltage (digital part) ground 2003 May 21 5 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW 90 ENLOUTQ 88 DLOOPQ 86 VCCD 85 CLOOPQ 91 ENLINQ 98 DOUTQ 95 COUTQ 87 DLOOP 100 VEE 99 VCCD 84 CLOOP 97 DOUT 94 COUT 96 VCCD 93 VCCD 92 INT 89 VCCD 83 VCCD handbook, full pagewidth VCCD PRSCLO PRSCLOQ UI LOS1 RSSI1 LOSTH1 VCCA IN1 1 2 3 4 5 6 7 8 9 76 VCCD 75 VCCD 74 VEE 73 D12Q 72 D12 71 D11Q 70 D11 69 D10Q 68 D10 67 D09Q 66 D09 65 D08Q 64 D08 63 VEE 62 D07Q 61 D07 60 D06Q 59 D06 58 D05Q 57 D05 56 D04Q 55 D04 54 D03Q 53 D03 52 ENBA 51 VCCD VEE 50 MGU315 82 D15Q 80 D14Q 78 D13Q D02 48 81 D15 79 D14 IN1Q 10 VCCA 11 INSEL 12 WINSIZE 13 RREF 14 VCCA 15 IN2 16 IN2Q 17 VCCA 18 LOSTH2 19 RSSI2 20 LOS2 21 CS(DR0) 22 SDA(DR1) 23 SCL(DR2) 24 VDD 25 VEE 26 INWINDOW 27 i.c. 28 i.c. 29 DMXR0 30 DMXR1 31 VCCO 32 CREF 33 CREFQ 34 VCCD 35 FP 36 FPQ 37 PARITY 38 PARITYQ 39 VCCD 40 POCLK 41 POCLKQ 42 VCCD 43 D00 44 D00Q 45 D01 46 D01Q 47 D02Q 49 TZA3012AHW Fig.2 Pin configuration. 2003 May 21 6 77 D13 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver FUNCTIONAL DESCRIPTION The TZA3012AHW receives data from an incoming bit stream having a bit rate from 30 Mbits/s up to 3.2 Gbits/s. Two line inputs with limiting amplifiers are available. An internal DCR synchronizes the internal clock generator to the incoming data. The recovered serial data and clock are demultiplexed at ratios of 1:16, 1:10, 1:8 or 1:4. Choice of user interface The TZA3012AHW can be controlled either via the I2C-bus or using programming pins DR0 to DR2. Pin UI selects the user interface required. I2C-bus control and A-rate functionality are enabled when pin UI is either open circuit or connected to VCC. Pre-programmed mode is enabled when pin UI is connected to VEE; see Table 1. Table 1 UI LOW HIGH Truth table for pin UI MODE pre-programmed I2C-bus control PIN 22 DR0 CS PIN 23 DR1 SDA PIN 24 DR2 SCL Table 3 TZA3012AHW Truth table for selecting bit rate in pre-programmed mode (pin UI = VEE) DR1 LOW LOW HIGH HIGH LOW LOW HIGH HIGH DR0 LOW HIGH LOW HIGH LOW HIGH LOW HIGH PROTOCOL STM1/OC3 STM4/OC12 STM16/OC48 STM16 + FEC GE 10GE Fibre Channel Fibre Channel BIT RATE (Mbits/s) 155.52 622.08 2488.32 2666.06 1250.00 3125.00 1062.50 2125.00 DR2 LOW LOW LOW LOW HIGH HIGH HIGH HIGH After power-up, the TZA3012AHW initiates a Power-On Reset (POR) sequence to restore the default settings of the I2C-bus registers, irrespective of the level on pin UI. The default settings are shown in Table 12. Limiting amplifiers The TZA3012AHW has two switchable RF line inputs. Each input has a limiting amplifier (limiter) which provides optimum receiver sensitivity at any bit rate. The bandwidth of each limiter is automatically adjusted in accordance with the input bit rate. This ensures that wideband noise present in the optical front-end (photo-detector and transimpedance amplifier) is reduced at low input bit rates. The maximum bandwidth is selected by default at power-up. The bandwidth can be set independently of input bit rate using bits AMPOCT in I2C-bus register LIMCNF (address C2H). Normally, only one limiter is activated at any one time so that only the RF signal applied to the active channel is routed to the DCR. The unused limiter automatically enters a sleep mode to reduce power dissipation. A limiter is selected by pin INSEL as shown in Table 4. Table 4 PIN INSEL HIGH LOW Truth table for pin INSEL SELECTED CHANNEL channel 1; limiter 1 active channel 2; limiter 2 active SELECTED INPUTS IN1 and IN1Q IN2 and IN2Q In I2C-bus control mode, the chip is configured using the I2C-bus pins SDA and SCL. During I2C-bus read or write actions, pin CS must be HIGH. When pin CS is LOW, the programmed configuration remains active but signals SDA and SCL are ignored. This allows several TZA3012AHWs in the application with the same I2C-bus address to be selected separately. The I2C-bus address of the TZA3012AHW is shown in Table 2. Table 2 A6 1 I2C-bus address of the TZA3012AHW A5 0 A4 1 A3 0 A2 0 A1 0 A0 0 R/W X The function and content of the I2C-bus registers are described in Section "I2C-bus registers". Some functions in the TZA3012AHW can be controlled either by the I2C-bus or a designated pin. The method required is specified by an extra bit named I2C A limiter can also be selected by setting bit I2CINSEL in I2C-bus register LIMCNF, and specifying bit INSEL as shown in Table 5. Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 5 Channel selection PIN INSEL INSEL X X 0 1 LOW HIGH X X SELECTED CHANNEL channel 2; limiter 2 active channel 1; limiter 1 active channel 2; limiter 2 active channel 1; limiter 1 active TZA3012AHW Received Signal Strength Indicator (RSSI) The strength of signal present at each RF input is measured by a logarithmic detector and represented by an analog voltage at pins RSSI1 and RSSI2 for channels 1 and 2, respectively. The RSSI has a sensitivity of 17 mV/dB typical for an input voltage swing Vi(p-p) range of 5 mV to 500 mV; see Fig.4. RSSI output voltage VRSSI can be calculated using the following formula: V i(p-p) V RSSI = V RSSI(32 mV) + S RSSI x 20log ---------------32 mV Both logarithmic detectors are always active to allow the input with the strongest signal to be selected. Loss Of Signal (LOS) indicator In addition to the analog RSSI output, the TZA3012AHW also provides a digital LOS indication output on pins LOS1 and LOS2. The RSSI level is internally compared with a LOS threshold voltage level, which can be set either by an external resistor connected to pins LOSTH1 and LOSTH2, or by using an internal D/A converter. The method used is determined by bit I2CREFLVL1 in I2C-bus register LIMLOS1CNF (address BDH) for channel 1, or bit I2CREFLVL2 in I2C-bus register LIMLOS2CNF (address BFH) for channel 2. Using the internal D/A converter requires a value representing the threshold voltage to be programmed into I2C-bus registers LIMLOS1TH (address BCH) or LIMLOS2TH (address BEH). This allows separate LOS threshold levels to be specified per channel. If the received signal strength is below the default hysteresis value of 3 dB, the corresponding LOS pin will be HIGH. Alternative hysteresis values from 0 to 7 dB in steps of 1 dB can be specified using bits HYS1 and HYS2 in I2C-bus registers LIMLOS1CNF and LIMLOS2CNF respectively. If required, the polarity of the LOS indicator outputs can be inverted by setting bits LOS1POL and LOS2POL in the same registers. The LOS function can be disabled by setting bit LOS1 or LOS2 to logic 0 for channel 1 or channel 2 respectively. The LOS function is also available using I2C-bus registers INTERRUPT and STATUS; see Sections "Interrupt register" and "Status register". If bit LOS1 or LOS2 in register INTERRUPT is not masked, a loss of signal condition will generate an interrupt signal at pin LOS1 or pin LOS2. Bits LOS1 and LOS2 are masked by default; see Section "Interrupt generation". I2C BIT I2CINSEL 0 0 1 1 Both limiters can be made active by setting bit BOTHON in I2C-bus register LIMCNF. This allows `hot switching', where the second channel can be selected quickly if the first channel loses its signal. Note that even when both limiters are active, only one channel is selected at any time; see Table 6. When only one limiter is active, the time taken to deactivate its limiter and activate the limiter in the other channel takes 4 s typical. Table 6 Channel and limiter selection with bit BOTHON SELECTED CHANNEL channel 1; limiter 1 active channel 1; limiters 1 and 2 active channel 2; limiter 2 active channel 2; limiters 1 and 2 active SELECTED INPUTS IN1 and IN1Q IN1 and IN1Q I2C BIT PIN BOTHON INSEL 0 1 HIGH HIGH 0 1 LOW LOW IN2 and IN2Q IN2 and IN2Q handbook, halfpage VCCA IN 50 50 INQ VEE MDB385 Fig.3 Limiter input termination configuration. 2003 May 21 8 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth MBL555 1.2 VRSSI (V) 0.9 SRSSI 0.6 0.3 0 5 10 32 102 300 500 103 Vi(p-p) (mV) Fig.4 VRSSI as a function of Vi(p-p). Setting LOSTH reference level by external resistor If the internal D/A converter is not used, the reference voltage level on pin LOSTH1 (or LOSTH2) can be set by connecting an external resistor (R2) from the relevant pin to ground. The voltage on the pin is determined by the ratio between R2 and R1; see Fig.5. For resistor R1 a value of 10 to 20 k is recommended, giving a current of 120 to 60 A. R2 The LOSTH voltage equals ------- x V ref R1 Voltage Vref represents a temperature stabilized and accurate reference voltage of 1.2 V. The minimum threshold level corresponds to 0 V and the maximum to 1.2 V. Hence, the value of R2 may not be higher than R1. The accuracy of the LOSTH voltage depends mainly on carefully choosing the values of the two external resistors. Instead of using resistors (R1 and R2) to set the LOS threshold, an accurate external voltage source can also be used. If no resistor is connected to LOSTH1 (or LOSTH2), or an external voltage higher than 23 x VCC is applied to the pin, the LOS detection circuit (including the RSSI reading for that channel) is automatically switched off to reduce power dissipation. This `auto power off' only works if UI = VEE, i.e. manual control of the TZA3012AHW. In I2C-bus mode, several I2C-bus bits allow flexible configuration. Fig.5 1.2 V Vref RREF I R1 10 k LOS compare LOSTH1 LOSTH2 R2 GND MGU318 VCCA RSSI LOS Setting the LOSTH reference level by external resistors. 2003 May 21 9 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Slice level adjustment The TZA3012AHW uses a slice level circuit to counter the affects of asymmetrical noise that can occur in some optical transmission systems. The slice level circuit improves pre-detection signal-to-noise ratio by adding a DC offset to the input signal. The offset required will depend on the characteristics of the photo detector in the optical front-end and the amplitude of the received signal. The slice level is adjustable between -50 mV and +50 mV in 512 steps of 0.2 mV. The slice level function is enabled by setting bits SL1 and SL2 in I2C-bus registers LIMLOS1CNF (address BDH) and LIMLOS2CNF (address BFH) for channel 1 and channel 2 respectively. The slice level is set by sign and magnitude convention. The sign, either positive or negative (polarity), is set by I2C-bus bits SL1SGN and SL2SGN. The magnitude, 0 to 50 mV in 256 steps, is set by an 8-bit D/A converter via I2C-bus register LIMSLICE1 (address C0H) and LIMSLICE2 (C1H) for channel 1 and channel 2 respectively. The introduced offset is not present at inputs IN and INQ to prevent the logarithmic RSSI detector from detecting the offset as a valid input signal. Data and Clock Recovery (DCR) The TZA3012AHW recovers the clock and data contents from the incoming bit stream; see Fig.6. The DCR uses a combined frequency and phase locking scheme, providing reliable and quick data acquisition at any bit rate between 30 Mbits/s and 3.2 Gbits/s. The DCR contains a Voltage Controlled Oscillator (VCO), Frequency Window Detector (FWD), octave divider M, main divider N, fractional divider K, reference divider R, and a phase detector. The internal VCO is phase-locked to a reference clock signal of typically 19.44 MHz applied to pins CREF and CREFQ. TZA3012AHW The FWD is a conventional frequency locked PLL, which, at power-up, initially applies a coarse adjustment to the free running VCO frequency. The FWD checks the VCO frequency, which has to be within a 1000 ppm (parts per million) window around the desired frequency. The FWD then compares the divided VCO frequency (also available on pins PRSCLO and PRSCLOQ) with the reference frequency, usually 19.44 MHz, on pins CREF and CREFQ. If the VCO frequency is found to be outside this window, the FWD disables the Data Phase Detector (DPD) and forces the VCO to a frequency within the window. As soon as the `in window' condition occurs, which is visible on pin INWINDOW, the DPD starts acquiring lock on the incoming bit stream. Since the VCO frequency is very close to the expected bit rate, the phase acquisition will be almost instantaneous, resulting in quick phase lock to the incoming data stream. Although the VCO is now locked to the incoming bit stream, the FWD is still supervising the VCO frequency and takes over control if the VCO drifts outside the predefined frequency window. This might occur during a `loss of signal' situation. Due to the FWD, the VCO frequency is always close to the required bit rate, enabling rapid phase acquisition if the lost input signal returns. The default frequency window of 1000 ppm means that the reference frequency does not need to be highly accurate or stable. Any crystal-based oscillator that generates a reasonably accurate frequency, such as 100 ppm, is suitable. 2003 May 21 10 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth LIMITING AMPLIFIER DATA PHASE DETECTOR OCTAVE DIVIDER up down /M VOLTAGE CONTROLLED OSCILLATOR (VCO) /N RECOVERED DATA RECOVERED CLOCK DOUT(Q) COUT(Q) DATA IN to DEMULTIPLEXER CHARGE PUMP N [8:0] 9 K [21:0] 22 LOOP FILTER + FRACTION CALCULATOR MAIN DIVIDER REFERENCE DIVIDER CREF(Q) REFERENCE INPUT /R up FREQUENCY WINDOW DETECTOR down CHARGE PUMP PRESCALER OUTPUT PRSCLO(Q) MGU346 Fig.6 Block diagram of data and clock recovery. Fractional N synthesizer The DCR uses a fractional N-type synthesizer to provide the A-rate functionality that allows the DCR to synchronize to incoming data, regardless of its bit rate. The DCR has a 22-bit fractional N capability which allows any combination of bit rate and reference frequency between 18 x R and 21 x R MHz, where R is the reference division factor. The LSB (bit k[0]) of the fractional divider, should be set to logic 1 to avoid limit cycles. These are cycles of less than maximum length that generate spurs in the frequency spectrum. This leaves 21 bits (k[21:1]) available for programming the fraction, allowing a resolution frequency of approximately 10 Hz at a fixed reference frequency. Programming the reference clock Pre-programmed operation requires a reference clock frequency of between 18 and 21 MHz connected to pins CREF and CREFQ. However, to obtain the bit rates in Table 3, the reference clock frequency must be 19.44 MHz. For SDH/SONET applications, a reference clock frequency of 19.44 x R MHz is preferred. I2C-bus control operation allows any one of four possible reference clock frequency ranges to be selected by programming reference divider R using bits REFDIV in I2C-bus register DCRCNF (address B6 H). The REFDIV bit settings, reference clock frequency ranges, and division factor are shown in Table 7. The reference frequency is always divided internally to the lowest range of 18 to 21 MHz. Table 7 Truth table for bits REFDIV in I2C-bus register DCRCNF R DIVISION FACTOR 1 2 4 8 SDH/SONET REFERENCE FREQUENCY (MHz) 19.44 38.88 77.76 155.52 REFERENCE FREQUENCY RANGE (MHz) 18 to 21 36 to 42 72 to 84 144 to 168 REFDIV 00 01 10 11 2003 May 21 11 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Programming the DCR The following dividers are used to program the clock synthesizer: the main divider N, the fractional divider K and the octave divider M. The division factor for M is obtained by first determining in which octave the desired bit rate belongs as shown in Figure 7 and Tables 8 and 9. Table 9 TZA3012AHW Common optical transmission protocols and corresponding octaves BIT RATE (Mbits/s) 3125.00 2970.00 2666.06 2488.32 2380.00 2125.00 1485.00 1380.00 1300.00 1250.00 1062.50 1062.50 1062.50 622.08 595.00 425.00 265.63 212.50 200.00 155.52 125.00 125.00 106.25 51.84 OCTAVE 0 0 0 0 0 0 1 1 1 1 1 1 1 2 2 3 3 4 4 4 4 4 5 6 PROTOCOL 10GE 2xHDTV STM16/OC48 + FEC STM16/OC48 DV-6000 handbook, 6 halfpage 5 4 3 2 1 0 Fibre Channel HDTV D-1 Video DV-6010 Gigabit Ethernet (GE) Fibre Channel OptiConnect 28.125 56.25 112.5 225 450 900 1800 3200 Mbits/s MGU316 ISC STM4/OC12 DV-6400 Fibre Channel OptiConnect Fibre Channel ESCON/SBCON STM1/OC3 FDDI Fast Ethernet Fibre Channel OC1 Fig.7 Allocation of octaves for common bit rates shown on a logarithmic scale. Table 8 Octave designation and M division factor HIGHEST BIT RATE (Mbits/s) 3200 1800 900 450 225 112.5 56.25 OCTAVE 0 1 2 3 4 5 6 M DIVISION FACTOR 1 2 4 8 16 32 64 LOWEST BIT RATE (Mbits/s) 1800 900 450 225 112.5 56.25 28.125 Once the octave and M division factor are known, the division factors for N and K can be calculated for a given reference frequency using the Flowchart in Fig.8. 2003 May 21 12 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth CALCULATE N and K n, k = bit rate x M x R f ref n is integer part k is fractional part yes k=0? no NILFRAC = 1 NILFRAC = 0 no no no 0.25 < k < 0.75 yes k 0.25 ? yes k 0.75 ? yes k = k + 0.5 N=2xn N=2xn N=2xn-1 k = k - 0.5 N=2xn+1 j = 21 k=kx2 no k1? yes Kj = 1 k=k-1 Kj = 0 decimal to binary conversion of fractional part j=j-1 j=0? yes Kj = 1 no Write K j into registers B3H, B4H and B5H Convert N to binary and write into registers B1H and B2H END MGW570 Fig.8 Flowchart for calculating N and K for the required bit rate. 2003 May 21 13 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver The following examples refer to the flowchart in Fig.8. TZA3012AHW Example 1: An SDH or SONET link has a bit rate of 2488.32 Mbits/s (STM16/OC48) that corresponds to octave 0 and an M division factor of 1. If the reference frequency fref at pins CREF and CREFQ is 77.76 MHz, the division factor R is required to be 4. The initial values for integer n and fractional part k are calculated using the equation: 2488.32 Mbits x 1 x 4 bit rate x M x R n.k = --------------------------------------- = -------------------------------------------------------- = 128 77.76 MHz f ref In this example, n = 128 and k = 0. Since k is 0, fractional functionality is not required, so bit NILFRAC in I2C-bus register FRACN2 should be set to logic 1; see Table 19. N = n x 2 = 256 with no further correction required. The resulting values of R = 4, M = 1 and N = 256 are set by I2C-bus registers DCRCNF (Table 22), DIVCNF (Table 16), MAINDIV1 (Table 17) and MAINDIV0 (Table 18). Example 2: An SDH or SONET link has a bit rate of 2666.057143 Mbits/s (15/14 x 2488.32 Mbits/s) (STM16/OC48 link with FEC) that corresponds to octave 0 and an M division factor of 1. If fref at pins CREF and CREFQ is 38.88 MHz, the division factor R is required to be 2. The values for n and k are calculated as follows: bit rate x M x R 2666.05714283 Mbits x 1 x 2 n.k = --------------------------------------- = ---------------------------------------------------------------------------- = 137.1428571 f ref 38.88 MHz In this example, n = 137 and k = 0.1428571. Fractional functionality is required, so bit NILFRAC in I2C-bus register FRACN2 should be set to logic 0. Since k is less than 0.25, k is corrected to k = k + 0.5 = 0.6428571, and N is corrected to N = n x 2 - 1 = 273. The resulting values of R = 2, M = 1, N = 273 and K = 10 1001 0010 0100 1001 0011 are set by I2C-bus registers DCRCNF (Table 22), DIVCNF (Table 16), MAINDIV1 (Table 17), MAINDIV0 (Table 18), FRACN2 (Table 19), FRACN1 (Table 20) and FRACN0 (Table 21). The FEC bit rate is usually rounded up to 2666.06 Mbits/s, which actually gives a different value for k than in this example. Example 3: A Fibre Channel link has a bit rate of 1062.50 Mbits/s that corresponds to octave 1 and an M division factor of 2. If fref at pins CREF and CREFQ is 19.44 MHz, the division factor R is required to be 1. The values for n and k are 1062.50 Mbits x 2 x 1 bit rate x M x R calculated as follows: n.k = --------------------------------------- = -------------------------------------------------------- = 109.3106996 19.44 MHz f ref In this example, n = 109 and k = 0.3107. Fractional functionality is required, so bit NILFRAC in I2C-bus register FRACN2 should be set to logic 0. Since k is greater than 0.25 and less than 0.75, k does not need to be corrected. N is corrected to N = n x 2 = 218. The resulting values of R = 1, M = 2, N = 218 and K = 01 0011 1110 0010 1000 0001 are set by I2C-bus registers DCRCNF (Table 22), DIVCNF (Table 16), MAINDIV1 (Table 17), MAINDIV0 (Table 18), FRACN2 (Table 19), FRACN1 (Table 20) and FRACN0 (Table 21). Example 4: A non standard transmission link has a bit rate of 3012 Mbits/s that corresponds to octave 0 and an M division factor of 1. If fref at pins CREF and CREFQ is 20.50 MHz, the division factor R is required to be 1. The values bit rate x M x R 3012 Mbits x 1 x 1 for n and k are calculated as follows: n.k = --------------------------------------- = ----------------------------------------------- = 146.9268293 f ref 20.50 MHz In this example, n = 146 and k = 0.9268293. Fractional functionality is required, so bit NILFRAC in I2C-bus register FRACN2 should be set to logic 0. Since k is greater than 0.75, k is corrected to k = k - 0.5 = 0.4268293, and N is corrected to N = n x 2 + 1 = 293. The resulting values of R = 1, M = 1, N = 293 and K = 01 1011 0101 0001 0010 1011 are set by I2C-bus registers DCRCNF (Table 22), DIVCNF (Table 16), MAINDIV1 (Table 17), MAINDIV0 (Table 18), FRACN2 (Table 19), FRACN1 (Table 20) and FRACN0 (Table 21). If the I2C-bus is not used, the clock synthesizer can be set up for the eight pre-programmed bit rates shown in Table 3, by pins DR0, DR1 and DR2 using an external reference clock frequency of 19.44 MHz. 2003 May 21 14 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Prescaler outputs The frequency of prescaler outputs PRSCLO and PRSCLOQ is the VCO frequency divided by a ratio of N.K. If the synthesizer is in-lock, the frequency of the prescaler output is equal to the reference frequency at CREF and CREFQ divided by R which also corresponds to the recovered data rate. This provides an accurate reference that can be used by other phase locked loops in the application. If required, the polarity of the prescaler outputs can be inverted by setting bit PRSCLOINV in I2C-bus register IOCNF0 (address CBH) to logic 1. If no prescaler information is required, its output can be disabled by setting bit PRSCLOEN in the same register to logic 0. In addition, the prescaler output can be set for type of output, termination mode and signal amplitude. These parameter settings also apply to the parallel output clock POCLK and POCLKQ and parity error output PARERR and PARERRQ. For programming details, These parameter settings also apply to the parallel demultiplexer outputs. For programming details; see Section "Configuring the parallel interface". Programming the FWD The default window for frequency acquisition is 1000 ppm around the desired bit rate. The size of window determines the amount of variation in the frequency of the applied reference clock, and VCO, that is tolerated by the FWD. The window size can be set to other predefined values between 250 and 2000 ppm by bits WINDOWSIZE in I2C-bus register DCRCNF (address B6H). An additional feature allows the size of the frequency acquisition window to be set to 0 ppm, which effectively removes the `dead zone' from the FWD, converting it to a classical PLL. The VCO will then be directly phase-locked to the reference signal instead of the incoming bit stream. This is implemented by either applying a LOW level to pin WINSIZE, or by setting bit WINSIZE to logic 0 and bit I2CWINSIZE to logic 1 in I2C-bus register DCRCNF; see Table 10. Table 10 Truth table for pin WINSIZE WINSIZE LOW HIGH WINDOW SIZE (ppm) 0 1000 TZA3012AHW Accurate clock generation during loss of signal During a loss of signal, there is no data present for clock recovery to use. A frequency acquisition window size of zero will make the recovered clock frequency equal to the reference frequency, including its tolerance. Setting bit AUTOWIN in I2C-bus register DCRCNF makes the window size dependent on the LOS status of the active limiter channel. If the optical input signal is lost, the FWD automatically selects the 0 ppm window size, so that the VCO is directly phase-locked to the reference signal. This ensures that the output clock signal remains stable during loss of signal, and automatically reverts to normal DCR operation when the input signal returns. Note that the accuracy of the reference frequency must be better than 20 ppm for the application to comply with ITU-T recommendations. INWINDOW signal The status of the FWD circuit is indicated by the level on pin INWINDOW. A HIGH level indicates that the VCO is within the defined frequency acquisition window size, and a LOW level indicates that the VCO is outside the defined window size. The status of the FWD circuit is also indicated by bit INWINDOW in I2C-bus registers INTERRUPT and STATUS. Jitter performance The clock synthesizer is optimized for minimum jitter generation. For all SDH/SONET bit rates, the generated jitter complies with ITU-T standard G.958 using a pure reference clock. To ensure negligible loss of performance when a reference clock is used, the reference signal should have a single sideband phase noise of better than -140 dBc/Hz, at frequencies of more than 12 kHz from the carrier. If reference divider R is used, this negative value is allowed to increase at approximately 20 x log (R). Demultiplexer The demultiplexer converts the serial input bit stream to parallel formats of 1:16, 1:10, 1:8, and 1:4. The output data is available on a scalable bus, of which the output driver type can be either LVPECL or CML. In addition to the deserializing function, the demultiplexer comprises a parity calculator and a frame header detection circuit. A calculated parity of EVEN is output at pins PARITY and PARITYQ. A detected frame header pattern in the data stream results in a 1 clock cycle wide pulse on outputs FP and FPQ. 2003 May 21 15 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Making pin ENBA HIGH automatically aligns the parallel output into logical bytes or words. The same function is implemented by setting bit ENBA in I2C-bus register DMXCNF (address A8H). To support most commonly used transmission systems and protocols, the demultiplexing ratio can be set to 1:16, 1:10, 1:8, and 1:4, and the frame header pattern programmed to any 32 or 10-bit pattern; see Section "Frame detection". If required, the demultiplexer output can be forced into a fixed logic 0 state by bit DMXMUTE in I2C-bus register DMXCNF. Adjustable demultiplexing ratio For optimum layout connectivity, the physical positions of parallel data bus pins D00 to D15 and D00Q to D15Q on the chip are located either side of pin VEE (pin 63). The number of parallel data bus outputs that are used Table 11 Setting demultiplexing ratio PIN DMXR1 LOW LOW HIGH HIGH PIN DMXR0 LOW HIGH LOW HIGH BITS DMXR (REG DMXCNF) 00 01 10 11 DEMULTIPLEXING RATIO 1:4 1:8 1:10 1:16 TZA3012AHW depends on the demultiplexing ratio selected by pins DMXR0 and DMXR1 or by bits DMXR in I2C-bus register DMXCNF (address A8 H). Any unused parallel data bus outputs are disabled. The configuration settings and active outputs for each demultiplexing ratio are shown in Table 11. In I2C-bus control mode, the default demultiplexing ratio is 16:1. To allow optimum layout connectivity, the pin designations of the parallel data bus bits can be reversed so that the default designated pin for D15 (MSB) is exchanged with the default designated pin for D0 (LSB). This is implemented by bit BUSSWAP in I2C-bus register DMXCNF (address A8H). The highest supported speed for the parallel data bus is 400 Mbits/s. Therefore a demultiplexing ratio of 4:1 will support bit rates of up to 1.6 Gbits/s. ACTIVE OUTPUTS LSB to MSB D06 to D09 D04 to D11 D03 to D12 D00 to D15 Frame detection Byte alignment is enabled if the Enable Byte Alignment input (pin ENBA) is HIGH, or if bit I2CENBA and bit ENBA are both logic 1 in I2C-bus register DMXCNF (address A8H). Whenever the incoming data has a 32-bit or 10-bit sequence that matches the programmed frame header pattern, the data is formatted into logical bytes or words, and a frame pulse is generated on differential outputs FP and FPQ. Any frame header pattern can be programmed in I2C-bus registers HEADER0 to HEADER3. Any bit position can be programmed with a `don't care' to give a frame header pattern that is either much shorter than 32 or 10 bits, or has gaps. The "don't care" bits are produced by programming a pattern into I2C-bus registers HEADERX0 to HEADERX3 which is used to mask the programmed frame header pattern as shown in the example Fig.9. The default frame header pattern is F6F62828H, corresponding to the middle section of the standard SDH/SONET frame header (the last two A1 bytes plus the first two A2 bytes). 2003 May 21 16 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth MSB HEADER BIT32 HEADER3 0 0 0 1 0 1 1 1 0 1 LSB HEADER BIT1 1 0 0 0 1 0 HEADER0 HEADERX3 1 0 0 0 0 1 0 0 0 0 0 0 0 0 1 1 HEADERX0 X 0 0 1 0 X 1 1 0 1 1 0 0 0 X X received data data stream MGU548 `X' = "don't care" `MSB' = Most Significant Byte. Fig.9 Example of programming the frame header pattern. If ENBA is LOW, no active alignment takes place. However, if the frame header pattern occurs in the formatted data, a frame pulse will still be output on pins FP and FPQ. For 10-bit oriented protocols, such as Gigabit Ethernet, the frame header detection operates on a 10-bit pattern sequence. These 10 bits should be programmed into I2C-bus registers HEADER3 and the two MSBs of HEADER2; the remaining 22 bits are ignored. A `don't care' pattern overlay can be programmed in I2C-bus register HEADERX3 and the two MSBs of HEADERX2. Since some 10-bit oriented protocols use a DC balancing code, the detection pattern could appear in complementary form in the data stream. By setting bit CMPL in I2C-bus register DMXCNF (address A8H), the header detection scans the data stream for both the programmed pattern and its complement simultaneously. Either occurrence produces a `byte' alignment and a corresponding frame pulse on pins FP and FPQ. The default pattern (after power-up) is `0011111010' or K28.5 character plus alternating 010. This is the only pattern containing five consecutive bits of the same sign. Receiver framing in SDH/SONET applications Figure 10 shows a typical SDH/SONET reframe sequence involving byte alignment. Frame and byte boundary detection is enabled on the rising edge of ENBA and remains enabled while ENBA is HIGH. Boundaries are recognized on receipt of the second A2 byte and FP goes HIGH for one POCLK cycle. In 1:16 mode, the first two A2 bytes in the frame header are the first data word to be reported with the correct alignment on the outgoing data bus (D00 to D15). In 1:8 mode the first A2 byte is the first aligned data byte (D04 to D11), while in 1:4 mode the most significant nibble of the first A2 byte is the first aligned data (D06 to D09). When interfacing with a section terminating device, ENBA must remain HIGH for a full frame after the initial frame pulse. This is to allow the section terminating device to verify internally that frame and byte alignment are correct; see Fig.11. Byte boundary detection is disabled on the first FP pulse after ENBA has gone LOW. Figure 12 shows frame and byte boundary detection activated on the rising edge of ENBA, and deactivated by the first FP pulse after ENBA has gone LOW. 2003 May 21 17 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth serial clock ENBA 32 bits serial data A1 invalid data A1 A1 A2 A2 valid data 1 : 16 D00 to D15 (1:16) A2 28 28 A2 POCLK (1:16) FP (1:16) 1:4 D06 to D09 (1:4) 2 A2 8 2 A2 8 POCLK (1:4) FP (1:4) MGU550 Fig.10 Frame and byte detection in SDH/SONET application. handbook, halfpage boundary detection enabled handbook, halfpage boundary detection enabled ENBA FP MGU340 ENBA FP MGU341 Fig.11 ENBA timing with section terminating device. Fig.12 Alternate ENBA timing. 2003 May 21 18 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Parity generation Outputs PARITY and PARITYQ provide the even parity of the byte/word that is currently available on the parallel bus. Odd parity can be output by setting bit PARINV to logic 1 in I2C-bus register IOCNF2 (address C9H). If no parity output is required, and/or to reduce output power, set bit PAREN, in the same register, to logic 0. Configuring the parallel interface There are several options for configuring the parallel interface which comprises the parallel data bus and associated outputs. The options for parallel data output D00 to D15 and D00Q to D15Q, parallel clock output POCLK and POCLKQ, parity output PARITY and PARITYQ, frame pulse output FP and FPQ, and prescaler output PRSCLO and PRSCLOQ are: output driver type, termination mode, output amplitude, signal polarity, and selective enabling or disabling. The parallel data bus pin designations can also be reversed and/or muted. These options are set in I2C-bus registers IOCNF3 (address C8H) and IOCNF2 (address C9H), IOCNF0 (address CBH) and DMXCNF (address A8H). I2C-bus register IOCNF3, bit MFOUTMODE selects either the CML or LVPECL output driver. The default is LVPECL. Bit MFOUTTERM sets the output termination mode to either standard LVPECL or floating termination, or in CML mode, to either DC or AC-coupled. In all cases, bits MFS adjust the amplitude. The default output amplitude is 800 mV (p-p) single-ended. In I2C-bus register IOCNF2, setting bit PDEN to logic 0 disables the parallel interface output driver. This is not the same effect as setting bit DMXMUTE in I2C-bus register DMXCNF (address A8H), which forces the outputs to a logic 0 state. Setting bit PDINV to logic 1 in I2C-bus register IOCNF2 (address C9H) inverts the polarity of the parallel data. Setting bit POCLKINV to logic 1 in the same register inverts the clock output so that the clock edge is shifted by half a clock cycle, changing the rising edge to a falling edge. This function can be used to resolve a parallel data bus timing problem. The parallel bus clock is disabled by setting bit POCLKEN to logic 0 in the same register. Control bits in the same register and in register IOCNF0 (address CBH) also apply the same options to the parity, frame pulse and prescaler outputs. Loop mode I/Os TZA3012AHW In line loopback mode, the internal data and clock routing switch routes the received serial data and recovered clock to outputs DOUT, DOUTQ COUT and COUTQ instead of to the demultiplexer. Line loopback mode is activated by a LOW level on pin ENLOUTQ. Line loopback mode is also selected by setting bit ENLOOPOUT and bit I2CLOOPMODE in I2C-bus register DIVCNF (address B0H). In diagnostic loopback mode, the demultiplexer selects the serial data and clock signals at loop mode input pins DLOOP, DLOOPQ and CLOOP, CLOOPQ instead of from the DCR. Diagnostic loopback mode is activated by a LOW level on pin ENLINQ. Diagnostic loopback mode is also selected by setting bit ENLOOPIN and bit I2CLOOPMODE in I2C-bus register DIVCNF (address B0H). Configuring the RF I/Os The polarity of specific RF serial data and clock I/O signals can be inverted using I2C-bus register IOCNF1 (address CAH). To allow easier connection to other ICs, the pin designations for input data can be exchanged with the pin designations for input clock. The pin designations for output data and output clock can also be exchanged. The default pin designations for Loop mode input data and clock are exchanged by setting bit CDINSWAP in I2C-bus register IOCNF1 so that signals at pins CLOOP and CLOOPQ are treated as data and signals at pins DLOOP and DLOOPQ are treated as clock. The default pin designations for Loop mode output data and clock are exchanged by setting bit CDOUTSWAP in I2C-bus register IOCNF1 so that signals at pins COUT and COUTQ are treated as data and signals at pins DOUT and DOUTQ are treated as clock. The amplitude of the RF serial output signals in CML drive mode, is adjustable (in 16 steps) between 60 mV (p-p) and 1000 mV (p-p), single-ended, controlled by bits RFS and RFSWING in I2C-bus register IOCNF0 (address CBH). The default amplitude is 80 mV (p-p), single-ended. The RF serial outputs are AC-coupled. 2003 May 21 19 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver CMOS control inputs CMOS control inputs UI, INSEL, WINSIZE, DMXR0, DMXR1, ENBA, ENLOUTQ, ENLINQ and CS(DR0) have an internal pull-up resistor so that these pins go HIGH when open circuit, and only go LOW when deliberately forced. This is also true for pins DR1 and DR2 in pre-programmed mode (pin UI is LOW). In I2C-bus control mode (pin UI is HIGH), pins SCL and SDA comply with the I2C-bus interface standard. Power supply connections Four separate supply domains (VDD, VCCD, VCCO and VCCA) provide isolation between the various functional blocks. Each supply domain should be connected to a common VCC using a separate filter. All supply pins, including the exposed die pad, must be connected. The die pad connection to ground must have the lowest possible inductance. Since the die pad is also used as the main ground return of the chip, this connection must also have a low DC impedance. The voltage supply levels should be in accordance with the values specified in Chapters "Characteristics" and "Limiting values". All external components should be surface mounted, with a preferable size of 0603 or smaller. The components must be mounted as close to the IC as possible. Interrupt register The following events are recorded by setting the appropriate bit(s) in I2C-bus register INTERRUPT (address 00 H): * Loss of signal on channel 1 * Loss of signal on channel 2 * DCR frequency locked or unlocked * Limiter channel switching enabled or disabled * High junction temperature. When register INTERRUPT is polled by an I2C-bus read action, any set bits are reset. If a condition is still active, the corresponding bit remains set. Status register TZA3012AHW The current status of the conditions that are recorded by register INTERRUPT are indicated by setting the appropriate bit(s) in I2C-bus register STATUS (address 01H). A bit is set only for the period that the condition is active and resets when the condition clears. Register STATUS is polled by an I2C-bus read action. Interrupt generation An interrupt is generated if an interrupt condition sets a bit in I2C-bus register INTERRUPT (address 00H) and if the bit is not masked by I2C-bus register INTMASK (address CCH). Only the high junction temperature interrupt bit is not masked by default. A generated interrupt is indicated by an active logic level at pin INT. The active output level used is set by bit INTPOL in I2C-bus register INTMASK. The default is an active LOW level. Bit INTOUT sets the output mode at pin INT to either open-drain or to standard CMOS. The default is open-drain. An active LOW output in open-drain mode allows several receivers to be connected together, and requires only one 3.3 k pull-up resistor. 2003 May 21 20 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver CHARACTERISTICS OF THE I2C-BUS TZA3012AHW The I2C-bus is for 2-way, 2-line communication between different ICs or modules. The two lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. Bit transfer Refer to Fig.13. One data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the HIGH period of the clock pulse as changes in the data line at this time will be interpreted as control signals. handbook, full pagewidth SDA SCL data line stable; data valid change of data allowed MBC621 Fig.13 Bit transfer. Start and stop conditions Refer to Fig.14. Both data and clock lines remain HIGH when the bus is not busy. A HIGH-to-LOW transition of the data line, while the clock is HIGH is defined as the start condition (S). A LOW-to-HIGH transition of the data line while the clock is HIGH is defined as the stop condition (P). handbook, full pagewidth SDA SDA SCL S START condition P STOP condition SCL MBC622 Fig.14 Definition of start and stop conditions. 2003 May 21 21 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver System configuration TZA3012AHW Refer to Fig.15. A device generating a message is a `transmitter', a device receiving a message is the `receiver'. The device that controls the message is the `master' and the devices which are controlled by the master are the `slaves'. SDA SCL MASTER TRANSMITTER / RECEIVER SLAVE TRANSMITTER / RECEIVER MASTER TRANSMITTER / RECEIVER MBA605 SLAVE RECEIVER MASTER TRANSMITTER Fig.15 System configuration. Acknowledge Refer to Fig.16. Only one data byte is transferred between the start and stop conditions during a write from the transmitter to the receiver. Each byte of eight bits is followed by an acknowledge bit. The acknowledge bit is a HIGH level signal put on the bus by the transmitter during which time the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed must generate an acknowledge after the reception of each byte. Also a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges must pull down the SDA line during the acknowledge clock pulse, so that the SDA line is stable LOW during the HIGH period of the acknowledge related clock pulse (set-up and hold times must be taken into consideration). A master receiver must signal an end-of-data to the transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this event the transmitter must leave the data line HIGH to enable the master to generate a stop condition; see Fig.19. handbook, full pagewidth DATA OUTPUT BY TRANSMITTER not acknowledge DATA OUTPUT BY RECEIVER acknowledge SCL FROM MASTER S START condition clock pulse for acknowledgement MBC602 1 2 8 9 Fig.16 Acknowledgment on the I2C-bus. 2003 May 21 22 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver I2C-BUS PROTOCOL Addressing TZA3012AHW Before any data is transmitted on the I2C-bus, the device which should respond is addressed first. The address byte is sent after the start condition. The master transmitter/receiver either reads from the read-registers or writes to the write-registers. It is not possible to read from and write to the same register. Figure 17 shows how the slave and register address bytes are defined. handbook, full pagewidth MSB LSB MSB LSB R/W 1 Slave address Register address MDB070 Fig.17 Slave and register addresses. Read/Write protocols The protocol for writing to a single register is shown in Fig.18. The transmitter sends the address of the slave device, waits for an acknowledge from the slave, sends register address, waits for an acknowledge from the slave, sends data byte, waits for an acknowledge from the slave, followed by a stop condition. handbook, full pagewidth acknowledge from slave R/W MSB S SLAVE ADDRESS acknowledge from slave MSB REGISTER ADDRESS acknowledge from slave LSB 0A1 A DATA A P one byte transferred MDB386 Fig.18 Write protocol. The protocol for reading one or more registers is shown in Fig.19. The receiver sends the address of the slave device, waits for an acknowledge from the slave, receives data byte(s) from the slave (the TZA3012AHW starts sending data after asserting an acknowledge), after receiving the data, the receiver sends an acknowledge or, if finished, a not-acknowledge, followed by a stop condition. 2003 May 21 23 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth acknowledge from slave R/W S SLAVE ADDRESS MSB acknowledge from master (1) LSB acknowledge from master (1) MSB acknowledge from master (1) LSB 1A DATA A A DATA A P first byte last byte MDB387 (1) The master receiver must signal an end of data to the slave transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. Fig.19 Read protocol. I2C-bus registers The I2C-bus registers are accessed in I2C-bus control mode by setting pin UI HIGH or leaving pin UI open circuit. Address and read/write data are transferred serially via pin SDA and clocked via pin SCL when pin CS (chip select) is HIGH. The I2C-bus registers are listed in Table 12. 2003 May 21 24 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 12 I2C-bus registers ADDRESS (HEX)(1) 00 01 A0 NAME INTERRUPT STATUS HEADER3 FUNCTION Interrupt register; see Table 13 Status register; see Table 14 Programmable header, most significant byte 1:10 ratio A1 HEADER2 Programmable header 1:10 ratio A2 A3 A4 HEADER1 HEADER0 HEADERX3 Programmable header Programmable header, least significant byte Programmable header, don't care, most significant byte 1:10 ratio A5 HEADERX2 Programmable header, don't care 1:10 ratio A6 A7 A8 B0 B1 B2 B3 B4 B5 B6 BC BD BE BF C0 C1 C2 C8 C9 CA CB CC Notes 1. Addresses not shown must not be accessed. 2. X = don't care. 2003 May 21 25 HEADERX1 HEADERX0 DMXCNF DIVCNF MAINDIV1 MAINDIV0 FRACN2 FRACN1 FRACN0 DCRCNF LIMLOS1TH LIMLOS2TH LIMSLICE1 LIMSLICE2 LIMCNF IOCNF3 IOCNF2 IOCNF1 IOCNF0 INTMASK Programmable header, don't care Programmable header, don't care, least significant byte Demultiplexer configuration register; see Table 15 Octave and loop mode configuration register; see Table 16 Main divider division factor N; most significant byte; range 128 to 511; see Table 17 Fractional divider division factor K; see Table 19 Fractional divider division factor K; see Table 20 Fractional divider division factor K; see Table 21 DCR configuration register; see Table 22 Limiter 1 loss of signal threshold register; range 0 to 255 Limiter 2 loss of signal threshold register; range 0 to 255 Limiter 1 slice level register; range 0 to 255 Limiter 2 slice level register; range 0 to 255 Limiter configuration register; see Table 25 Parallel interface output configuration register 3; see Table 26 Parallel interface output configuration register 2; see Table 27 RF serial I/O configuration register 1; see Table 28 RF serial output configuration register 0; see Table 29 Interrupt masking register; see Table 30 TZA3012AHW DEFAULT VALUE - - 1111 0110 0011 1110 1111 0110 10X XXXX 0010 1000 0010 1000 0000 0000 0000 0000 0000 0000 00XX XXXX 0000 0000 0000 0000 0000 1011 0000 0000 0000 0001 READ/ WRITE R R W W W W W W W W W W W W W W W W W W W W W W W W W W W W Main divider division factor N; least significant byte; see Table 18 0000 0000 1000 0000 0000 0000 0000 0000 0000 1100 0000 0000 0000 1101 0000 0000 0000 1101 0000 0000 0000 0000 0000 1000 0000 1100 1010 1010 0000 0000 0010 0011 0101 0000 LIMLOS1CNF Limiter 1 loss of signal configuration register; see Table 23 LIMLOS2CNF Limiter 2 loss of signal configuration register; see Table 24 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 13 Register INTERRUPT (address 00H) BIT 7 6 5 4 3 2 1 0 1 0 1 0 1 0 1 0 PARAMETER DESCRIPTION loss of signal on channel 1 TZA3012AHW NAME LOS1 no signal present (loss of signal condition) signal present loss of signal on channel 2 no signal present (loss of signal condition) signal present DCR frequency indication frequency outside predefined window (unlocked) frequency inside predefined window (locked) auto-switching between channels enabled (active limiter indicated in Status register) disabled (no auto-switching between channels) high junction temperature TALARM junction temperature 130 C junction temperature <130 C reserved LIMSW INWINDOW LOS2 1 0 0 0 0 2003 May 21 26 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 14 Register STATUS (address 01H) BIT 7 6 5 4 3 2 1 1 0 1 0 1 0 0 PARAMETER DESCRIPTION loss of signal on channel 1 TZA3012AHW NAME LOS1 no signal present (loss of signal condition) signal present loss of signal on channel 2 no signal present (loss of signal condition) signal present DCR frequency indication frequency inside predefined window (locked) frequency outside predefined window (unlocked) active limiter indication LIMSEL limiter 1 active limiter 2 active high junction temperature TALARM junction temperature 130 C junction temperature <130 C reserved INWINDOW LOS2 1 0 1 0 0 0 0 2003 May 21 27 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 15 Register DMXCNF (address A8H); default value 0BH BIT 7 6 5 4 3 2 1 1 1 0 0 1 0 0 1 0 1 0 1:16 1:10 1:8 1:4 demultiplexing ratio programming via I2C-bus interface via pins DMXR0 and DMXR1 frame header detection in 1:10 Gigabit Ethernet mode 1 0 1 0 1 0 1 0 1 0 0 0 0 0 1 0 1 1 PARAMETER DESCRIPTION demultiplexing ratio TZA3012AHW NAME DMXR I2CDMXR CMPL simultaneously check for complementary header check programmed header only parallel data bus bit designations D00 = MSB, D15 = LSB (reversed) D15 = MSB, D00 = LSB (normal) demultiplexer mute parallel interface outputs DMXMUTE mute; parallel interface outputs forced to logic 0 no mute enable/disable byte alignment enabled disabled ENBA control via I2C-bus interface via pin ENBA default value I2CENBA ENBA BUSSWAP 2003 May 21 28 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 16 Register DIVCNF (address B0H); default value 00H BIT 7 6 5 4 3 2 1 0 PARAMETER DESCRIPTION octave divider division factor M, octave selection 0 0 0 0 1 1 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 0 0 1 0 1 0 1 0 1 0 M = 1, octave number 0 M = 2, octave number 1 M = 4, octave number 2 M = 8, octave number 3 M = 16, octave number 4 M = 32, octave number 5 M = 64, octave number 6 reserved enable/disable loop mode inputs enabled disabled enable/disable loop mode outputs enabled disabled loop mode control via I2C-bus interface TZA3012AHW NAME DIV_M ENLOOPIN ENLOOPOUT I2CLOOPMODE via pin ENLINQ and/or pin ENLOUTQ default value Table 17 Register MAINDIV1 (address B1H); default value 01H BIT 7 - 0 6 - 0 5 - 0 4 - 0 3 - 0 2 - 0 1 - 0 0 N8 1 default value PARAMETER DESCRIPTION main divider division factor N; N8 = MSB NAME DIV_N Table 18 Register MAINDIV0 (address B2H); default value 00H BIT 7 N7 0 6 N6 0 5 N5 0 4 N4 0 3 N3 0 2 N2 0 1 N1 0 0 N0 0 default value PARAMETER DESCRIPTION main divider division factor N; N0 = LSB NAME DIV_N 2003 May 21 29 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 19 Register FRACN2 (address B3H); default value 80H BIT 7 NF 6 X 5 K21 4 K20 3 K19 2 K18 1 K17 0 PARAMETER DESCRIPTION TZA3012AHW NAME DIV_K NILFRAC K16 fractional divider division value K; K21 = MSB NILFRAC control bit no fractional N functionality fractional N functionality 1 0 1 Note 1. X = don't care. 0 0 0 0 0 0 0 default value Table 20 Register FRACN1 (address B4H); default value 00H BIT 7 K15 0 6 K14 0 5 K13 0 4 K12 0 3 K11 0 2 K10 0 1 K9 0 0 K8 0 default value PARAMETER DESCRIPTION fractional divider division value K NAME DIV_K Table 21 Register FRACN0 (address B5H); default value 00H BIT 7 K7 0 6 K6 0 5 K5 0 4 K4 0 3 K3 0 2 K2 0 1 K1 0 0 K0 0 default value PARAMETER DESCRIPTION fractional divider division value K; K0 = LSB NAME DIV_K 2003 May 21 30 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 22 Register DCRCNF (address B6H); default value 0CH BIT 7 6 5 4 3 2 0 1 1 1 1 1 0 0 1 0 1 0 1 0 2000 ppm 1000 ppm 500 ppm 250 ppm PARAMETER DESCRIPTION FWD window size; relative to bit rate TZA3012AHW NAME WINDOWSIZE FWD window size select; WINDOWSIZE value or zero 1 window size specified by `WINDOWSIZE'; PLL frequency allowed to vary around the reference frequency window size = 0 ppm; PLL frequency directly synthesized from reference frequency WINSIZE control bit 1 0 1 0 via I2C-bus interface via pin WINSIZE automatic window size select enabled disabled WINSIZE 0 I2CWINSIZE AUTOWIN reference divider division factor R; reference REFDIV frequency 1 1 0 0 0 1 0 1 0 0 0 0 1 1 0 0 R = 8; 155.52 MHz R = 4; 77.76 MHz R = 2; 38.88 MHz R = 1; 19.44 MHz default value 2003 May 21 31 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 23 Register LIMLOS1CNF (address BDH); default value 0DH BIT 7 6 5 4 3 2 1 0 1 0 enabled disabled PARAMETER DESCRIPTION loss of signal detection on channel 1 TZA3012AHW NAME LOS1 loss of signal threshold level control bit on channel 1 1 0 via I2C-bus interface by internal DAC; register LIMLOS1TH via analog voltage on pin LOSTH1 loss of signal detection hysteresis on channel 1 0 0 0 0 1 1 1 1 1 0 1 0 1 0 0 0 0 0 1 1 0 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 dB 1 dB 2 dB 3 dB 4 dB 5 dB 6 dB 7 dB slice level on channel 1 enabled disabled slice level sign on channel 1 positive negative polarity of LOS on channel 1 inverted normal default value I2CREFLVL1 HYS1 SL1 SL1SGN LOS1POL 2003 May 21 32 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 24 Register LIMLOS2CNF (address BFH); default value 0DH BIT 7 6 5 4 3 2 1 0 1 0 enabled disabled PARAMETER DESCRIPTION loss of signal detection on channel 2 TZA3012AHW NAME LOS2 loss of signal threshold level control bit on channel 2 1 0 via I2C-bus interface by internal DAC; register LIMLOS2TH via analog voltage on pin LOSTH2 loss of signal detection hysteresis on channel 2 0 0 0 0 1 1 1 1 1 0 1 0 1 0 0 0 0 0 1 1 0 1 0 0 1 1 0 0 1 1 0 1 0 1 0 1 0 1 0 dB 1 dB 2 dB 3 dB 4 dB 5 dB 6 dB 7 dB slice level on channel 2 enabled disabled slice level sign on channel 2 positive negative polarity of LOS on channel 2 inverted normal default value I2CREFLVL2 HYS2 SL2 SL2SGN LOS2POL 2003 May 21 33 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 25 Register LIMCNF (address C2H); default value 08H BIT 7 6 5 4 3 2 0 0 0 0 1 1 0 1 0 1 0 0 0 Note 1. X = don't care. 0 0 0 0 1 0 0 0 1 0 0 1 1 X 0 0 1 0 1 X PARAMETER DESCRIPTION amplifier octave selection TZA3012AHW NAME AMPOCT octave number 0; 1800 to 3200 Mbits/s octave number 1; 900 to 1800 Mbits/s octave number 2; 450 to 900 Mbits/s octave number 3; 225 to 450 Mbits/s octave number 4; 30 to 225 Mbits/s channel selection channel 1 selected; limiter 1 active channel 2 selected; limiter 2 active channel selection control bit via I2C-bus interface; bit INSEL BOTHON via pin INSEL single/dual limiter selection both limiters active single limiter active, specified by bit INSEL reserved default value I2CINSEL INSEL 2003 May 21 34 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 26 Register IOCNF3 (address C8H); default value 0CH BIT 7 6 5 4 3 0 0 1 1 0 1 0 0 2 0 0 1 1 1 0 0 0 1 0 0 1 0 1 60 mV (p-p) minimum; 120 mV (p-p) default; 800 mV (p-p) maximum; 1000 mV (p-p) reserved parallel output termination LVPECL mode: floating; CML mode: AC-coupled PARAMETER DESCRIPTION parallel output signal amplitude TZA3012AHW NAME MFS MFOUTTERM LVPECL mode: standard; CML mode: DC-coupled parallel output mode MFOUTMODE Current Mode Logic (CML) Low Voltage Positive Emitter Coupled Logic (LVPECL) 1 0 0 0 0 0 1 1 0 0 default value 2003 May 21 35 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 27 Register IOCNF2 (address C9H); default value AAH BIT 7 6 5 4 3 2 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 inverted normal parallel data output enable enabled disabled parallel clock output polarity inverted normal parallel clock output enable enabled disabled parity output polarity inverted normal parity output enable enabled disabled frame pulse output polarity inverted normal frame pulse output enable enabled disabled default value PARAMETER DESCRIPTION parallel data output polarity TZA3012AHW NAME PDINV PDEN POCLKINV POCLKEN PARINV PAREN FPINV FPEN 2003 May 21 36 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 28 Register IOCNF1 (address CAH); default value 00H BIT 7 6 5 4 3 2 1 0 1 0 1 0 1 0 1 0 1 0 1 0 0 0 0 0 0 0 0 0 0 0 inverted normal loop mode data input polarity inverted normal loop mode clock and data inputs swap clock and data input pairs swapped normal loop mode clock output polarity inverted normal loop mode data output polarity inverted normal PARAMETER DESCRIPTION loop mode clock input polarity TZA3012AHW NAME CININV DININV CDINSWAP COUTINV DOUTINV loop mode clock and data outputs swap clock and data output pairs swapped normal reserved default value CDOUTSWAP 2003 May 21 37 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 29 Register IOCNF0 (address CBH); default value 23H BIT 7 6 5 4 3 0 0 1 2 0 0 1 1 0 1 1 0 0 1 1 PARAMETER DESCRIPTION RF serial output signal amplitude TZA3012AHW NAME RFS minimum: 20mV (p-p); 60 mV (p-p) high swing default: 80mV (p-p); 250 mV (p-p) high swing maximum: 300mV (p-p); 1000 mV (p-p) high swing prescaler output polarity PRSCLOINV inverted normal prescaler output enable PRSCLOEN enabled disabled RF serial output swing RFSWING high swing low swing reserved 1 0 1 0 1 0 0 0 0 1 0 0 0 1 1 default value 2003 May 21 38 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Table 30 Register INTMASK (address CCH); default value A0H BIT 7 6 5 4 3 2 1 0 1 0 1 0 1 0 1 0 1 0 0 1 0 1 0 0 Note 1. Signal is not processed by the interrupt controller. 1 0 1 0 0 0 0 not masked masked; note 1 mask LOS2 signal not masked masked; note 1 mask INWINDOW signal not masked masked; note 1 mask LIMSEL signal not masked masked; note 1 mask high junction temperature not masked masked; note 1 reserved pin INT polarity mode inverted; active LOW output normal; active HIGH output pin INT output mode standard CMOS output open-drain output default value PARAMETER DESCRIPTION mask LOS1 signal TZA3012AHW NAME MLOS1 MLOS2 MINWINDOW MLIMSEL MTALARM INTPOL INTOUT 2003 May 21 39 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW FEATURES IN PRE-PROGRAMMED MODE Although the TZA3012AHW is primarily intended to be programmed via the I2C-bus (pin UI HIGH), many of the TZA3012AHW functions can be accessed via the external chip pins in pre-programmed mode (pin UI LOW) as follows: * Choice of four pre-programmed SDH/SONET bit rates: STM1/OC3, STM4/OC12, STM16/OC48, STM16/OC48 + FEC; pins DR0 to DR2 * Choice of four pre-programmed bit rates; Fibre Channel, double Fibre Channel, Gigabit Ethernet, 10-Gigabit Ethernet; pins DR0 to DR2 * Choice of four demultiplexing ratios; 1:16, 1:10, 1:8 or 1:4 pins DMUXR1 and DMUXR0 * Input channel selection (INSEL) * Received signal strength indicator, independently for channels 1 and 2 * Loss of signal detection threshold for each input channel individually (LOSTH1 and LOSTH2) * Automatic disable of unused logarithmic detector (LOSTH1 and LOSTH2) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCCA, VCCD, VCCO, VDD Vn supply voltages DC voltage on pins D00 to D15, D00Q to D15Q, POCLK, POCLKQ, FP, FPQ, PARITY, PARITYQ, PRSCLO and PRSCLOQ LOSTH1, LOSTH2 and RREF RSSI1 and RSSI2 UI, INSEL, WINSIZE, CS, SDA, SCL, DMXR0, DMXR1, ENBA, ENLOUTQ and ENLINQ LOS1, LOS2 and INWINDOW INT In input current on pins IN1, IN1Q, IN2 and IN2Q CREF, CREFQ, CLOOP, CLOOPQ, DLOOP and DLOOPQ INT Tamb Tj Tstg ambient temperature junction temperature storage temperature -30 -20 -2 -40 - -65 PARAMETER MIN. -0.5 TZA3012AHW * Loop mode serial input and output configuration: pins ENLINQ and ENLOUTQ * Automatic byte alignment for SDH/SONET or Gigabit Ethernet (ENBA) * Frame detection for SDH/SONET (pattern is A1A1A2A2) or Gigabit Ethernet * EVEN parity generation * LVPECL outputs on parallel interface with 800 mV (p-p), single-ended signal, (DC-coupled termination to VCC - 2 V) * CML serial RF outputs with typical 80 mV (p-p), single-ended signal, (AC-coupled load) * In window detection (INWINDOW) * FWD window size select, WINDOWSIZE value ppm or 0 ppm (WINSIZE) * High junction temperature indication (pin INT; open-drain) * 18 to 21 MHz reference frequency supported. MAX. +3.6 UNIT V VCC - 2.5 -0.5 -0.5 -0.5 -0.5 -0.5 VCC + 0.5 VCC + 0.5 VCC + 0.5 VCC + 0.5 VCC + 0.5 VCC + 0.5 +30 +20 +2 +85 +125 +150 V V V V V V mA mA mA C C C 2003 May 21 40 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Notes 1. In compliance with JEDEC standards JESD51-5 and JESD51-7. PARAMETER thermal resistance from junction to ambient CONDITIONS notes 1 and 2 TZA3012AHW VALUE 16 UNIT K/W 2. Four-layer Printed-Circuit Board (PCB) in still air with 36 plated vias connected with the heatsink and the second and fourth layer in the PCB. CHARACTERISTICS VCC = 3.14 to 3.47 V; Tamb = -40 to +85 C; Rth(j-a) 16 K/W; all characteristics are specified for the default settings (note 1); all voltages are referenced to ground; positive currents flow into the device; unless otherwise specified. SYMBOL Supplies ICCA ICCD ICCO IDD ICC(tot) Ptot VIL VIH IIL IIH VOL VOH VOL IOH Vo(p-p) analog supply current digital supply current oscillator supply current digital supply current total supply current total power dissipation note 2 note 2 see Figs 20 and 22 15 270 20 0 305 0.96 - 0.8VCC VIL = 0 V VIH = VCC IOL = 1 mA IOH = -0.5 mA IOL = 1 mA VOH = VCC -200 - 0 VCC - 0.2 0 - 50 20 350 25 0 395 1.3 - - - - - - - - 80 27 450 33 1 511 1.77 mA mA mA mA mA W PARAMETER CONDITIONS MIN TYP MAX UNIT CMOS input: pins UI, DR0, DR1, DR2, INSEL, WINSIZE, DMXR0, DMXR1, ENBA, ENLOUTQ and ENLINQ LOW-level input voltage HIGH-level input voltage LOW-level input current HIGH-level input current 0.2VCC - - 10 V V A A V V CMOS output: pins LOS1, LOS2, INWINDOW and INT LOW-level output voltage HIGH-level output voltage 0.2 VCC 0.2 10 Open-drain output: pin INT LOW-level output voltage HIGH-level output current V A mV Serial output: pins COUT, COUTQ, DOUT and DOUTQ default output voltage swing single-ended with 50 (peak-to-peak value) external load; ENLOUTQ = LOW; see Figs 23 and 27; note 3 output impedance rise time fall time single-ended to VCC 20% to 80% 80% to 20% 110 Zo tr tf 80 - - 100 100 100 120 - - ps ps 2003 May 21 41 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SYMBOL tD-C PARAMETER data-to-clock delay CONDITIONS (COUT, COUTQ and DOUT, 80 DOUTQ) between differential crossovers; see Fig.29 between differential crossovers 40 MIN TYP 140 TZA3012AHW MAX 200 UNIT ps duty cycle COUT and COUTQ 50 60 % Serial input: pins CLOOP, CLOOPQ, DLOOP and DLOOPQ Vi(p-p) Vi Zi td tsu th input voltage (peak-to-peak value) DC input voltage input impedance clock delay set-up time hold time duty cycle signals CLOOP and CLOOPQ single-ended to VCC see Fig.30 see Fig.30 see Fig.30 between differential crossovers single-ended 50 VCC - 1 40 260 15 15 40 - - 50 340 30 30 50 1000 mV VCC + 0.25 V 60 400 60 60 60 ps ps ps % CML mode parallel output: pins D00 to D15, D00Q to D15Q, FP, FPQ, PARITY, PARITYQ, POCLK, POCLKQ, PRSCLO and PRSCLOQ Vo(p-p) default output voltage swing single-ended with 50 (peak-to-peak value) external load to VCC; AC-coupled; see Fig.27 or DC-coupled; see Fig.28; note 4 output impedance rise time fall time parallel bit rate single-ended to VCC 20% to 80% 80% to 20% 650 800 1000 mV Zo tr tf fPBR 70 200 200 - 95 250 250 - 110 350 350 400 ps ps Mbits/s LVPECL mode parallel output: pins D00 to D15, D00Q to D15Q, FP, FPQ, PARITY, PARITYQ, POCLK, POCLKQ, PRSCLO and PRSCLOQ VOH VOL Vo(p-p) HIGH-level output voltage LOW-level output voltage 50 termination to VCC - 2V; see Fig.24 50 termination to VCC - 2V; see Fig.24 VCC - 1.2 VCC - 2.0 700 VCC - 1.0 VCC - 0.9 VCC - 1.9 VCC - 1.7 900 1150 V V mV default output voltage swing LVPECL floating; Fig.21; (peak-to-peak value) single-ended with 50 external load to VCC; AC-coupled; see Fig.26 or DC-coupled; see Fig.25; note 4 rise time fall time parallel bit rate 20% to 80% 80% to 20% tr tf fpar 300 300 - 350 350 - 400 400 400 ps ps Mbits/s 2003 May 21 42 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SYMBOL PARAMETER CONDITIONS MIN TYP TZA3012AHW MAX UNIT Parallel timing output: pins D00 to D15, D00Q to D15Q, FP, FPQ, PARITY, PARITYQ, POCLK, POCLKQ, PRSCLO and PRSCLOQ tD-C tD-C skew data-to-clock delay D00 to D15/POCLK data-to-clock delay D06 to D09/POCLK duty cycle POCLK channel to channel skew D00 and Dn (between channels) channel to channel skew D06 and D09 (between channels) DMX 1:16, 1:10, 1:8; see Fig.31; note 5 -100 100 180 50 - 250 250 60 200 ps ps % ps DMX 1:4; see Fig.31; note 5 150 40 DMX 1:16, 1:10, 1:8; note 5 - skew DMX 1:4; note 5 - - 50 ps Reference: pin RREF Vref reference voltage 10 to 20 k resistor to VEE 1.17 - 0.8VCC 0.05VCC IOL = 3 mA 0 -10 - - 1.3 0.6 0.6 0.6 0 100 0.6 20 20 1.3 - 0 1.21 - - - - - - - - - - - - - - - - - - - 1.26 V I2C-bus pins SCL and SDA VIL VIH Vhys VOL IL Ci LOW-level input voltage HIGH-level input voltage hysteresis of Schmitt trigger inputs SDA LOW-level output voltage (open-drain) leakage current input capacitance 0.2VCC - - 0.4 +10 10 V V V V A pF I2C-bus timing fSCL tLOW tHD;STA tHIGH tSU;STA tHD;DAT tSU;DAT tSU;STO tr tf tBUF Cb tSP SCL clock frequency SCL LOW time hold time START condition SCL HIGH time set-up time START condition data hold time data set-up time set-up time STOP condition SCL and SDA rise time SCL and SDA fall time bus free time between STOP and START capacitive load on each bus line pulse width of allowable spikes 100 - - - - 0.9 - - 300 300 - 400 50 kHz s s s s s ns s ns ns s pF ns 2003 May 21 43 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SYMBOL VnL VnH Vi(p-p) Vsl Zi iso Vi(p-p) SRSSI VRSSI Vo(RSSI) PARAMETER noise margin at LOW-level noise margin at HIGH-level CONDITIONS MIN 0.1VCC 0.2VCC single-ended; note 6 note 7 differential 12 -50 80 - single-ended see Fig.4 Vi(p-p) = 32 mV (p-p); PRBS (231-1) input 30 to 3200 Mbits/s; PRBS (231-1); VCC = 3.14 to 3.47 V; T = 120 C 5 15 580 -50 - - - - 100 60 - 17 680 - TYP TZA3012AHW MAX - - 500 +50 120 - 500 20 780 +50 UNIT V V RF input: pins IN1, INQ1, IN2 and IN2Q input voltage swing (peak-to-peak value) typical slice level range input impedance between channel isolation mV mV dB Received Signal Strength Indicator (RSSI) input voltage swing (peak-to-peak value) RSSI sensitivity output voltage output voltage variation mV mV/dB mV mV Output: pins RSSI1 and RSSI2 Zo IO(source) IO(sink) hys ta td Vi(p-p) Vi Zi fCREF fCREF tacq tacq(pc) tacq(o) TDR output impedance output source current output sink current - - - note 8 Vi(p-p) = 3 dB Vi(p-p) = 3 dB single-ended - - - 50 VCC - 1 single-ended to VCC SDH/SONET requirement 40 -20 1 - - 3 - - - - 50 - 10 1 0.4 - 5 5 mA mA LOS detector hysteresis assert time de-assert time dB s s mV Reference frequency input: pins CREF and CREFQ input voltage (peak-to-peak value) DC input voltage input impedance reference clock frequency accuracy reference clock frequency 1000 VCC + 0.25 V 60 +20 ppm MHz s ms s bits see Table 7; R = 1, 2, 4 or 8 18 x R 30 Mbits/s 30 Mbits/s 30 Mbits/s 30 Mbits/s - - - - 19.44 x R 21 x R - - - 1000 200 10 10 - PLL characteristics acquisition time acquisition time at power cycle acquisition time octave change transitionless data run 2003 May 21 44 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SYMBOL Jitter tolerance Jtol(p-p) jitter tolerance (peak-to-peak value) STM1/OC3 mode (ITU-T G.958); PRBS (231-1); note 9 f = 6.5 kHz f = 65 kHz f = 1 MHz STM4/OC12 mode (ITU-T G.958); PRBS (231-1); note 10 f = 25 kHz f = 250 kHz f = 5 MHz STM16/OC48 mode (ITU-T G.958); PRBS (231-1); note 11 f = 100 kHz f = 1 MHz f = 20 MHz Notes 3 0.3 0.3 10 1 0.5 3 0.3 0.3 10 1 0.5 3 0.3 0.3 10 1 0.5 PARAMETER CONDITIONS MIN TYP TZA3012AHW MAX UNIT - - - UI UI UI - - - UI UI UI - - - UI UI UI 1. Default settings: UI = LOW (pre-programmed mode; see Table 1); DR0 = LOW, DR1 = HIGH, DR2 = LOW (STM16/OC48); INSEL = HIGH (limiter 1 active); WINSIZE = HIGH (1000 ppm); ENBA = HIGH (automatic byte alignment); ENLOUTQ = HIGH (DOUT, COUT disabled); ENLINQ = HIGH (DLOOP, CLOOP disabled); DMXR0 = HIGH, DMXR1 = HIGH (DMX ratio 1:16); CREF and CREFQ = 19.44 MHz; LOSTH2 not connected (LOS2 switched off); D00 to D15 and D00Q to D15Q, FP, FPQ, PARITY, PARITYQ, POCLK, POCLKQ, PRSCLO and PRSCLOQ not connected. 2. The total supply current and power dissipation is dependent on the IC setups such as swing and loop modes and termination conditions. 3. The output swing is adjustable in 16 steps controlled by bits RFS in I2C-bus register CBH. 4. The output swing is adjustable in 16 steps controlled by bits MFS in I2C-bus register IOCNF3 (address C8H). In standard LVPECL mode only swing = 12 (default) should be used. 5. With 50% duty cycle. 6. The RF input is protected against a differential overvoltage; the maximum input current is 30 mA. It is assumed that both inputs carry a complementary signal of the specified peak-to-peak value. 7. The slice level is adjustable in 256 steps controlled by I2C-bus registers LIMSLICE1 (address C0H) and LIMSLICE2 (address C1H). 8. The hysteresis is adjustable in 8 steps controlled by bits HYS1 and HYS2 in I2C-bus registers LIMLOS1CNF (address BDH) and LIMLOS2CNF (address BFH). 9. The Jtol(p-p) min. value is 0.25UI for Tamb = -40 C to 0 C at f = 65 kHz and 1 MHz. 10. The Jtol(p-p) min. value is 0.25UI for Tamb = -40 C to 0 C at f = 250 kHz and 5 MHz. 11. The Jtol(p-p) min. value is 0.25UI for Tamb = -40 C to 0 C at f = 1 MHz and 20 MHz. 2003 May 21 45 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth MBL556 50 ICCD (mA) 40 LVPECL standard 30 CML AC 20 LVPECL floating 10 CML DC 0 0 5 10 15 value of address C8H, bit 3 to bit 0 Fig.20 Supply current per parallel output. handbook, full pagewidth MBL557 1000 Vo(p-p) (mV) 800 LVPECL standard 600 LVPECL floating DEFAULT CML AC/DC 400 200 0 0 5 10 15 value of address C8H, bit 3 to bit 0 Fig.21 Output voltage swing of parallel output. 2003 May 21 46 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth MBL558 50 ICCD (mA) 40 CML AC 30 20 low swing 10 0 0 5 10 15 value of address CBH, bit 3 to bit 0 Serial outputs are off (default). Fig.22 Supply current per serial output. handbook, full pagewidth MBL559 1000 Vo(p-p) (mV) 800 600 CML AC (clock 2.4 GHz) 400 low swing 200 (ENLOUTQ = LOW) 0 0 5 10 15 value of address CBH, bit 3 to bit 0 Fig.23 Output voltage swing of serial output. 2003 May 21 47 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth SWING CONTROL VCC Vterm transmission lines 50 2V optional AC coupling OUT Iswing OUTQ 50 to highimpedance input 50 in 50 on-chip off-chip MBL562 Fig.24 Standard PECL mode. handbook, full pagewidth SWING CONTROL VCC OUT transmission lines 50 to highimpedance input Iswing OUTQ 50 100 in on-chip off-chip MBL560 Fig.25 Floating PECL mode (DC-coupled). 2003 May 21 48 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth SWING CONTROL VCC Vbias AC coupling OUT transmission lines 50 Iswing OUTQ 50 50 50 to highimpedance input in on-chip off-chip MBL561 Fig.26 Floating LVPECL mode (AC-coupled). handbook, full pagewidth recommended for serial outputs VCC 120 100 100 Vbias 50 transmission lines 50 to highimpedance input 50 SWING CONTROL 100 100 OUT Iswing OUTQ 50 in on-chip off-chip MBL563 Fig.27 CML mode (AC-coupled). 2003 May 21 49 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, full pagewidth SWING CONTROL VCC 100 100 50 transmission lines 50 50 OUT Iswing OUTQ 50 to highimpedance input in on-chip off-chip MBL564 Fig.28 CML mode (DC-coupled). handbook, full pagewidth COUT t D-C DOUT MGU345 The timing is measured from the crossover point of the clock output signal to the crossover point of the data output (all signals are differential). Fig.29 Loop mode output timing. 2003 May 21 50 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver TZA3012AHW handbook, halfpage CLOOP td tsu th DLOOP MBL554 The timing is measured from the crossover point of the clock input signal to the crossover point of the data input. Fig.30 Loop mode input timing. handbook, full pagewidth POCLK t D-C D00 to D15, FP, PARITY MGU343 The timing is measured from the crossover point of the clock output signal to the crossover point of the data output (all signals are differential). Fig.31 Parallel bus output timing. 2003 May 21 51 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver PACKAGE OUTLINE HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad TZA3012AHW SOT638-1 c y exposed die pad side X Dh 75 76 51 50 ZE A e E HE wM bp pin 1 index Lp L detail X Eh A A2 A1 (A3) 100 1 wM ZD 25 bp D HD 26 e vM A B vM B 0 scale DIMENSIONS (mm are the original dimensions) A UNIT max. mm 1.2 A1 0.15 0.05 A2 1.05 0.95 A3 0.25 bp 0.27 0.17 c 0.20 0.09 D(1) 14.1 13.9 Dh 7.1 6.1 E(1) 14.1 13.9 Eh 7.1 6.1 e 0.5 HD 10 mm HE L 1 Lp 0.75 0.45 v 0.2 w 0.08 y 0.08 ZD(1) ZE(1) 1.15 0.85 1.15 0.85 7 0 16.15 16.15 15.85 15.85 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT638-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 01-03-30 03-04-07 2003 May 21 52 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 220 C (SnPb process) or below 245 C (Pb-free process) - for all the BGA packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 235 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Manual soldering TZA3012AHW To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2003 May 21 53 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3) TZA3012AHW SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable suitable not not recommended(4)(5) recommended(6) 1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 2003 May 21 54 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION TZA3012AHW This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2003 May 21 55 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver PURCHASE OF PHILIPS I2C COMPONENTS TZA3012AHW Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011. 2003 May 21 56 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver NOTES TZA3012AHW 2003 May 21 57 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver NOTES TZA3012AHW 2003 May 21 58 Philips Semiconductors Product specification 30 Mbits/s up to 3.2 Gbits/s A-rateTM fibre optic receiver NOTES TZA3012AHW 2003 May 21 59 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2003 SCA75 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403510/02/pp60 Date of release: 2003 May 21 Document order number: 9397 750 10905 |
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